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Design services

来源: 发布时间:2016-4-15 16:21:48 浏览次数:0

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                                HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

                                    Package Design Team services include:

                                 Customer-centric design.

                                 High quality, reliable, and cost effective packaging proposal.

                                 DFM (Design For Manufacturing) and DFC (Design for Cost).

                                 Supporting auto- check of design and Drawings.

                                Design Capabilities:

                                   Multi-Chip ModulesMCM

                                   System-in-Package (SiP)

                                   Flip Chip Package

                                   Hybrid Package

                                   Package-in-Package (PiP)

                                   Package-on-Package (PoP)

                                   Embedded Package

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