Design services

来源: 发布时间:2016-4-15 16:21:48 浏览次数:0

            1. <sup><i><tfoot><sub><button></button><bdo><div></div></bdo></sub></tfoot><bdo></bdo></i></sup><acronym><ins><acronym></acronym></ins></acronym>



                                HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

                                    Package Design Team services include:

                                 Customer-centric design.

                                 High quality, reliable, and cost effective packaging proposal.

                                 DFM (Design For Manufacturing) and DFC (Design for Cost).

                                 Supporting auto- check of design and Drawings.

                                Design Capabilities:

                                   Multi-Chip ModulesMCM

                                   System-in-Package (SiP)

                                   Flip Chip Package

                                   Hybrid Package

                                   Package-in-Package (PiP)

                                   Package-on-Package (PoP)

                                   Embedded Package


                                上一篇: Simulation services